| Manufacturer | KohYoung |
|---|---|
| Model | KY-8030L |
| Year | 2008 |
| Location | Netherlands
|
The KohYoung KY-8030L is a high-precision PCB inspection machine designed for advanced solder paste inspection using patented 3D volume measurement technology. Manufactured in 2008, this equipment offers exceptional accuracy and repeatability, ensuring reliable detection of defects such as insufficient, excessive, or missing paste, bridging, shape deformity, and paste offset. It utilizes a 3D Shadow Free Moiré measurement principle with a 2MP camera, providing an XY pixel resolution of 20 µm and a Z resolution of 0.37 µm.
Inspection speeds vary between 15.0 cm²/sec in Shadow Free Mode and 19.7 cm²/sec in High Speed Mode, enabling efficient processing of PCBs. The machine achieves volume repeatability of less than 1% at 3 sigma on calibration targets and under 3% on actual PCBs. Height accuracy is maintained at 2 µm, with a maximum PCB warp compensation of ±3.5 mm and a maximum paste height of 400 µm. It supports minimum paste deposit sizes down to 150 µm for rectangles and 2000 µm for circles, with a minimum distance of 100 µm between deposits.
This model accommodates PCBs ranging from 50 x 50 mm up to 510 x 510 mm, with thicknesses between 0.4 and 5.0 mm and a maximum weight of 2 kg. The conveyor width adjusts automatically, with a fixed front and rear conveyor setup and a conveyor height adjustable between 870 and 970 mm.
Physically, the machine measures 1203 mm in length, 1000 mm in width, and 1512 mm in height, weighing approximately 550 kg. It features an open-top lid for easy access, a conveyor belt on the left side for PCB feeding, and a control panel equipped with an emergency stop button and other controls on the left side. Additionally, a mounted computer monitor and keyboard are attached on a side tray, facilitating user interaction with the inspection software. The machine appears clean and in good physical condition with no visible damage, making it suitable for integration into existing production lines requiring precise solder paste inspection.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
True patented 3D volume measurement
• No false calls – no escapes – no shadow problems
• Highest accuracy and repeatability
• No PCB color sensitivity
• Solder paste printing optimization - at its
Metrology Capability Volume, Area, Height, Offset, Bridging and Shape Deformity
Types of Defects Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset
Measurement Principle 3D Shadow Free Moiré
Camera Technology
Camera 2MPix
XY Pixel Resolution 20 µm
Z Resolution 0.37 µm
Inspection Performance
Inspection Speed at 20 µm Shadow Free Mode 15.0 cm2/sec
High Speed mode 19.7 cm2/sec
Volume Repeatability (on a KY Calibration Target) < 1% at 3 σ
Volume Repeatability (on a PCB) < 3% at 3 σ
Height Accuracy (on a KY Calibration Target) 2 µm
Gage R&R (± 50 tolerance) << 10 % at 6 σ
Max. PCB Warp Compensation ± 3.5 mm
Max. Paste Height 400 µm
Min. Paste Deposit Size at 20 µm Rectangle 150 µm
Circle 2000 µm
Min. Distance between Paste Deposit 100 µm (at 150 µm paste height)
PCB Handling
Min PCB size 50 x 50 mm
Max PCB size 510 x 510 mm
PCB thickness 0.4 ~ 5.0mm
Max PCB weight 2 kg
Bottom side clearance 25.4 mm
Conveyor Width Adjustment Automatic
Conveyor Fix Type Front/Rear Fixed (Factory Setting)
Conveyor Height 970 ~ 870mm
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 16 |
| Last activity | July 10, 2026 |
True patented 3D volume measurement
• No false calls – no escapes – no shadow problems
• Highest accuracy and repeatability
• No PCB color sensitivity
• Solder paste printing optimization - at its
Metrology Capability Volume, Area, Height, Offset, Bridging and Shape Deformity
Types of Defects Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset
Measurement Principle 3D Shadow Free Moiré
Camera Technology
Camera 2MPix
XY Pixel Resolution 20 µm
Z Resolution 0.37 µm
Inspection Performance
Inspection Speed at 20 µm Shadow Free Mode 15.0 cm2/sec
High Speed mode 19.7 cm2/sec
Volume Repeatability (on a KY Calibration Target) < 1% at 3 σ
Volume Repeatability (on a PCB) < 3% at 3 σ
Height Accuracy (on a KY Calibration Target) 2 µm
Gage R&R (± 50 tolerance) << 10 % at 6 σ
Max. PCB Warp Compensation ± 3.5 mm
Max. Paste Height 400 µm
Min. Paste Deposit Size at 20 µm Rectangle 150 µm
Circle 2000 µm
Min. Distance between Paste Deposit 100 µm (at 150 µm paste height)
PCB Handling
Min PCB size 50 x 50 mm
Max PCB size 510 x 510 mm
PCB thickness 0.4 ~ 5.0mm
Max PCB weight 2 kg
Bottom side clearance 25.4 mm
Conveyor Width Adjustment Automatic
Conveyor Fix Type Front/Rear Fixed (Factory Setting)
Conveyor Height 970 ~ 870mm
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
The KohYoung KY-8030L is a high-precision PCB inspection machine designed for advanced solder paste inspection using patented 3D volume measurement technology. Manufactured in 2008, this equipment offers exceptional accuracy and repeatability, ensuring reliable detection of defects such as insufficient, excessive, or missing paste, bridging, shape deformity, and paste offset. It utilizes a 3D Shadow Free Moiré measurement principle with a 2MP camera, providing an XY pixel resolution of 20 µm and a Z resolution of 0.37 µm.
Inspection speeds vary between 15.0 cm²/sec in Shadow Free Mode and 19.7 cm²/sec in High Speed Mode, enabling efficient processing of PCBs. The machine achieves volume repeatability of less than 1% at 3 sigma on calibration targets and under 3% on actual PCBs. Height accuracy is maintained at 2 µm, with a maximum PCB warp compensation of ±3.5 mm and a maximum paste height of 400 µm. It supports minimum paste deposit sizes down to 150 µm for rectangles and 2000 µm for circles, with a minimum distance of 100 µm between deposits.
This model accommodates PCBs ranging from 50 x 50 mm up to 510 x 510 mm, with thicknesses between 0.4 and 5.0 mm and a maximum weight of 2 kg. The conveyor width adjusts automatically, with a fixed front and rear conveyor setup and a conveyor height adjustable between 870 and 970 mm.
Physically, the machine measures 1203 mm in length, 1000 mm in width, and 1512 mm in height, weighing approximately 550 kg. It features an open-top lid for easy access, a conveyor belt on the left side for PCB feeding, and a control panel equipped with an emergency stop button and other controls on the left side. Additionally, a mounted computer monitor and keyboard are attached on a side tray, facilitating user interaction with the inspection software. The machine appears clean and in good physical condition with no visible damage, making it suitable for integration into existing production lines requiring precise solder paste inspection.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 16 |
| Last activity | July 10, 2026 |
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