Used KOH YOUNG KY3020T

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9,000 €

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Manufacturer Koh Young
Model KY3020T
Year 2014
Location Austria AT
Jérémie
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Jérémie R.

Automatic description (AI-Generated)

The Koh Young KY3020T is a PCB inspection system designed for detailed 3D solder paste inspection (SPI) and metrology. Manufactured in 2014, this unit weighs approximately 95 kg and has a height of 734 mm. It features a table-top design with machined dimensions of 780 x 1100 x 734 mm, suitable for integration into various production environments. The system accommodates PCB sizes ranging from a minimum of 50 x 50 mm up to a maximum of 460 x 410 mm, with PCB thickness capabilities between 0.4 mm and 4.0 mm and a maximum PCB weight of 2 kg.

The KY3020T utilizes a 3D shadow-free Moiré measurement principle with a 1-megapixel camera to provide volumetric and area metrology capabilities. It can measure volume, area, height, offset, bridging, and shape deformity of solder paste deposits. The inspection system is capable of detecting defects such as insufficient, excessive, or missing paste, bridging between solder joints, shape deformities, and paste offset errors.

The equipment is mounted on a sturdy metal cabinet with two doors, providing secure storage and support. An attached monitor, keyboard, and mouse are positioned on the right side of the unit, facilitating user interaction and control. The overall condition of the equipment and cabinet is clean with minor surface marks, indicating careful use. For safety, an emergency stop button is located on the top right side of the main unit, and a warning label indicating electrical or laser hazard is present, highlighting the need for proper operational precautions.

This Koh Young KY3020T model operates on a 220V, single-phase power supply with a frequency range of 50-60 Hz, drawing 0.8 A and consuming approximately 0.88 kW. It is a reliable and precise solution for quality control in PCB assembly processes, providing comprehensive solder paste inspection and metrology capabilities.

The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.

Seller's description

Table Top 3D SPI Metrology Capability: Volumen Area, Height, Offset, Bridging and Shape Deformity Type of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste offset Measurement Principle: 3D Shadow free Moiré Camera: 1MPix 220V, 1Phase, 50-60hz, 0,8A, 0,88kW,
weight 95kg,
Machinedimensions:780 x 1100 x 734mm
Max PCB size: 460 x 410mm Min
PCB size: 50 x 50mm
PCB Thickness: 0,4 - 4,0mm Max.
PCB weight 2kg

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase


Client type Machinery dealer
Active since 2011
Offers online 45
Last activity July 6, 2026

Seller's description

Table Top 3D SPI Metrology Capability: Volumen Area, Height, Offset, Bridging and Shape Deformity Type of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste offset Measurement Principle: 3D Shadow free Moiré Camera: 1MPix 220V, 1Phase, 50-60hz, 0,8A, 0,88kW,
weight 95kg,
Machinedimensions:780 x 1100 x 734mm
Max PCB size: 460 x 410mm Min
PCB size: 50 x 50mm
PCB Thickness: 0,4 - 4,0mm Max.
PCB weight 2kg

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase



Automatic description (AI-Generated)

The Koh Young KY3020T is a PCB inspection system designed for detailed 3D solder paste inspection (SPI) and metrology. Manufactured in 2014, this unit weighs approximately 95 kg and has a height of 734 mm. It features a table-top design with machined dimensions of 780 x 1100 x 734 mm, suitable for integration into various production environments. The system accommodates PCB sizes ranging from a minimum of 50 x 50 mm up to a maximum of 460 x 410 mm, with PCB thickness capabilities between 0.4 mm and 4.0 mm and a maximum PCB weight of 2 kg.

The KY3020T utilizes a 3D shadow-free Moiré measurement principle with a 1-megapixel camera to provide volumetric and area metrology capabilities. It can measure volume, area, height, offset, bridging, and shape deformity of solder paste deposits. The inspection system is capable of detecting defects such as insufficient, excessive, or missing paste, bridging between solder joints, shape deformities, and paste offset errors.

The equipment is mounted on a sturdy metal cabinet with two doors, providing secure storage and support. An attached monitor, keyboard, and mouse are positioned on the right side of the unit, facilitating user interaction and control. The overall condition of the equipment and cabinet is clean with minor surface marks, indicating careful use. For safety, an emergency stop button is located on the top right side of the main unit, and a warning label indicating electrical or laser hazard is present, highlighting the need for proper operational precautions.

This Koh Young KY3020T model operates on a 220V, single-phase power supply with a frequency range of 50-60 Hz, drawing 0.8 A and consuming approximately 0.88 kW. It is a reliable and precise solution for quality control in PCB assembly processes, providing comprehensive solder paste inspection and metrology capabilities.

The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.


About this seller

Client type Machinery dealer
Active since 2011
Offers online 45
Last activity July 6, 2026

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Koh Young is the global leader in 3D Solder Paste Inspection technology. KSMART, Aspire, and zenith SPI platforms dominate SMT solder paste verification across automotive, industrial, and high-reliability electronics manufacturing.

Used KOH YOUNG KY3020T