| Manufacturer | SAKI AOI / SPI |
|---|---|
| Model | BF-3Di |
| Year | 2013 |
| Location | USA
|
The SAKI BF-3Di is a semiconductor inspection machine combining Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) capabilities, manufactured in 2013. This model features true 3D imaging technology, allowing comprehensive inspection of surface mount devices (SMD) and pin through-hole (PTH) packages. It measures component heights ranging from 0 to 20 mm and captures the surfaces of components from all four directions without any blind spots, enhancing defect detection accuracy.
Designed to accommodate extra-large circuit boards, the BF-3Di supports board sizes up to 686 x 870 mm. The machine operates on a 200-240V power supply.
The unit includes quad directional side cameras and top light illumination to ensure detailed imaging. It is equipped with an emergency stop button and a control panel featuring a pressure gauge and selector switch located on the right side for operational control and safety.
A monitor is mounted on an adjustable arm with a keyboard on a sliding tray below, facilitating user interaction and programming. The machine rests on adjustable leveling feet to ensure stability during operation.
Externally, the machine is clean and in good physical condition with only minor scuffs and scratches noted, and no major damage visible. The rear panel includes ventilation openings with a coiled power cable attached.
Internally, the machine houses components such as fans, wiring, mechanical parts, and a linear motor assembly labeled "HITIN Linear Motor." Warning labels caution about magnetic forces and pacemaker safety, as well as danger near a slot opening.
Two SAKI-branded manuals are included: the "BF-3Di Manual" and the "3D AOI Programming Manual," providing comprehensive guidance for operation and programming.
This inspection system combines the strengths of both 2D and 3D inspection technologies, offering a versatile solution for semiconductor quality control.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
AOI & SPI INSPECTION
2013 SAKI BF-3Di true 3D AOI Machine.
200-240V
Quad Directional Side Cameras
Top Light Illumination
Extra Component Detection
- Measure heights from 0 to 20mm
- Measure the surface of the surface mount device (SMD) and pin through-hole (PTH) package from all four directions without a dead angle
- extra-large boards of 686x870mm
- TRUE 3D Imaging
- Best of both 2D and 3D features from SAKI
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Client type | Machinery dealer |
| Active since | 2014 |
| Offers online | 17 |
| Last activity | July 15, 2026 |
AOI & SPI INSPECTION
2013 SAKI BF-3Di true 3D AOI Machine.
200-240V
Quad Directional Side Cameras
Top Light Illumination
Extra Component Detection
- Measure heights from 0 to 20mm
- Measure the surface of the surface mount device (SMD) and pin through-hole (PTH) package from all four directions without a dead angle
- extra-large boards of 686x870mm
- TRUE 3D Imaging
- Best of both 2D and 3D features from SAKI
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
The SAKI BF-3Di is a semiconductor inspection machine combining Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) capabilities, manufactured in 2013. This model features true 3D imaging technology, allowing comprehensive inspection of surface mount devices (SMD) and pin through-hole (PTH) packages. It measures component heights ranging from 0 to 20 mm and captures the surfaces of components from all four directions without any blind spots, enhancing defect detection accuracy.
Designed to accommodate extra-large circuit boards, the BF-3Di supports board sizes up to 686 x 870 mm. The machine operates on a 200-240V power supply.
The unit includes quad directional side cameras and top light illumination to ensure detailed imaging. It is equipped with an emergency stop button and a control panel featuring a pressure gauge and selector switch located on the right side for operational control and safety.
A monitor is mounted on an adjustable arm with a keyboard on a sliding tray below, facilitating user interaction and programming. The machine rests on adjustable leveling feet to ensure stability during operation.
Externally, the machine is clean and in good physical condition with only minor scuffs and scratches noted, and no major damage visible. The rear panel includes ventilation openings with a coiled power cable attached.
Internally, the machine houses components such as fans, wiring, mechanical parts, and a linear motor assembly labeled "HITIN Linear Motor." Warning labels caution about magnetic forces and pacemaker safety, as well as danger near a slot opening.
Two SAKI-branded manuals are included: the "BF-3Di Manual" and the "3D AOI Programming Manual," providing comprehensive guidance for operation and programming.
This inspection system combines the strengths of both 2D and 3D inspection technologies, offering a versatile solution for semiconductor quality control.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Machinery dealer |
| Active since | 2014 |
| Offers online | 17 |
| Last activity | July 15, 2026 |
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