| Manufacturer | Royce Instruments |
|---|---|
| Model | DE35i-6 |
| Year | |
| Location | USA
|
The Royce Instruments DE35i-6 is a semiautomatic pick and place machine designed for precise die handling and placement. It features a clamping device capable of securing wafers up to 150mm in diameter, facilitating vacuum pickup of dies from film-mounted wafers. The machine supports placement of dies into waffle packs, accommodating a minimum die size of 0.008 inches square. This model is equipped with an Optem zoom microscope and includes a coaxial fiber illuminator to enhance visibility during operation. Additional features include a power supply monitor and a crosshair generator to aid in accurate placement.
The machine's working area includes a circular stage with adjustable knobs for precise positioning of PCBs or wafers, which can be securely clamped during processing. Mounted above the stage is a camera on an adjustable arm, allowing for detailed visual inspection and alignment during the pick and place process. The control panel is integrated into a blue housing and features a numeric keypad along with function keys for operational control. A CRT monitor is part of the setup, displaying black and white images that assist in PCB placement tasks.
An instruction manual or brochure titled "DE35 DIE PICK & PLACE SYSTEM" is included, providing guidance for operation and maintenance. The overall technical condition of the machine is reported as good. This setup is suitable for applications requiring precise die placement and handling, with integrated visual aids and controls to support efficient operation.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
Offer Title: Royce Instruments DE35i-6 Pick and Place Machine
Manufacturer: Royce Instruments
Model: DE35i-6
Technical Condition: Good
Features:
- Semiautomatic pick and place configuration
- Clamping device for wafers up to 150mm
- Vacuum pickup of die from film mounted wafers
- Placement into waffle packs
- Minimum die size: 0.008" square
- Equipped with Optem zoom microscope
- Coaxial fiber illuminator included
- Power supply monitor and crosshair generator included
Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 57 |
| Last activity | Oct. 17, 2026 |
Offer Title: Royce Instruments DE35i-6 Pick and Place Machine
Manufacturer: Royce Instruments
Model: DE35i-6
Technical Condition: Good
Features:
- Semiautomatic pick and place configuration
- Clamping device for wafers up to 150mm
- Vacuum pickup of die from film mounted wafers
- Placement into waffle packs
- Minimum die size: 0.008" square
- Equipped with Optem zoom microscope
- Coaxial fiber illuminator included
- Power supply monitor and crosshair generator included
Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.
The Royce Instruments DE35i-6 is a semiautomatic pick and place machine designed for precise die handling and placement. It features a clamping device capable of securing wafers up to 150mm in diameter, facilitating vacuum pickup of dies from film-mounted wafers. The machine supports placement of dies into waffle packs, accommodating a minimum die size of 0.008 inches square. This model is equipped with an Optem zoom microscope and includes a coaxial fiber illuminator to enhance visibility during operation. Additional features include a power supply monitor and a crosshair generator to aid in accurate placement.
The machine's working area includes a circular stage with adjustable knobs for precise positioning of PCBs or wafers, which can be securely clamped during processing. Mounted above the stage is a camera on an adjustable arm, allowing for detailed visual inspection and alignment during the pick and place process. The control panel is integrated into a blue housing and features a numeric keypad along with function keys for operational control. A CRT monitor is part of the setup, displaying black and white images that assist in PCB placement tasks.
An instruction manual or brochure titled "DE35 DIE PICK & PLACE SYSTEM" is included, providing guidance for operation and maintenance. The overall technical condition of the machine is reported as good. This setup is suitable for applications requiring precise die placement and handling, with integrated visual aids and controls to support efficient operation.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 57 |
| Last activity | Oct. 17, 2026 |
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