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| Manufacturer | Hesse Mechatronics |
|---|---|
| Model | BJ820 |
| Year | 2008 |
| Location | Switzerland
|
The Hesse Mechatronics BJ820 is a wire bonder designed for semiconductor applications, specifically configured for wedge-wedge bonding. This model, manufactured in 2008, features a bondhead positioned at a 60° angle and includes an e-box as part of its current setup. The equipment is primarily used to create precise wire connections in semiconductor devices.
This unit incorporates several key components to facilitate its operation. It includes a microscope branded Leica, which is integrated inside the machine to assist with detailed visual inspection and alignment during the bonding process. A large monitor screen is mounted on the left side of the equipment, providing a clear display interface for monitoring and control purposes. The front of the machine is equipped with a control panel featuring a keypad and a slot, allowing for user input and operational adjustments.
For safety, the machine is fitted with an emergency stop button located on the right side, ensuring quick shutdown capability in case of any operational issues. The color scheme of the machine is green and white, consistent with Hesse & Knipps design aesthetics.
Modifications to the machine's configuration are possible upon request, allowing for customization to meet specific production requirements. Please note that no information regarding the machine's dimensions, weight, engine power, or current functionality status is provided. This wire bonder is suitable for semiconductor manufacturing environments where precise and reliable wire bonding is necessary.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
Wire Bonder
Hesse BJ820
Vers. 1
Current configuration:
- Wedge-wedge,
- Bondhead 60°
- e-box
Modifications possible upon request
Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 18 |
| Last activity | Oct. 16, 2026 |
Wire Bonder
Hesse BJ820
Vers. 1
Current configuration:
- Wedge-wedge,
- Bondhead 60°
- e-box
Modifications possible upon request
Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.
The Hesse Mechatronics BJ820 is a wire bonder designed for semiconductor applications, specifically configured for wedge-wedge bonding. This model, manufactured in 2008, features a bondhead positioned at a 60° angle and includes an e-box as part of its current setup. The equipment is primarily used to create precise wire connections in semiconductor devices.
This unit incorporates several key components to facilitate its operation. It includes a microscope branded Leica, which is integrated inside the machine to assist with detailed visual inspection and alignment during the bonding process. A large monitor screen is mounted on the left side of the equipment, providing a clear display interface for monitoring and control purposes. The front of the machine is equipped with a control panel featuring a keypad and a slot, allowing for user input and operational adjustments.
For safety, the machine is fitted with an emergency stop button located on the right side, ensuring quick shutdown capability in case of any operational issues. The color scheme of the machine is green and white, consistent with Hesse & Knipps design aesthetics.
Modifications to the machine's configuration are possible upon request, allowing for customization to meet specific production requirements. Please note that no information regarding the machine's dimensions, weight, engine power, or current functionality status is provided. This wire bonder is suitable for semiconductor manufacturing environments where precise and reliable wire bonding is necessary.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 18 |
| Last activity | Oct. 16, 2026 |
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