| Manufacturer | Hesse Mechatronics |
|---|---|
| Model | BJ820 |
| Year | 2008 |
| Location | Switzerland
|
The Hesse Mechatronics BJ820 is a semiconductor wire bonder designed for precision wedge-wedge bonding applications. Manufactured in 2008, this model features a bondhead angled at 60°, which supports detailed and accurate bonding processes. The machine is equipped with an e-box and is presented in a green and white enclosure, securely mounted on a wooden pallet for transport or storage.
The BJ820 includes a control panel located on the right side, featuring a keyboard, a red emergency stop button, and multiple control buttons, allowing for comprehensive user interaction and operational control. On the left side, a large display screen provides clear visualization of machine settings and calibration data.
Visible through a transparent window on the front, the internal bonding mechanism allows for easy monitoring of the bonding process. The screen displays calibration parameters such as bondhead frequency at 94 kHz, bondforce characteristics including force constant and spring tension, and precise camera settings for focus and pixel ratios, indicating the machine's capability for fine adjustments.
Graphs shown on the display present bondforce versus voltage and ultrasonic current versus frequency, reflecting the machine's detailed calibration status and ultrasonic current resonance for optimal bonding performance.
The machine appears clean and in good physical condition with no visible damage, suggesting careful maintenance. Modifications to the configuration can be made upon request to suit specific production needs. This wire bonder is suitable for semiconductor manufacturing environments requiring reliable and precise wedge bonding.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
Wire Bonder
Hesse BJ820
Vers. 1
Current configuration:
- Wedge-wedge,
- Bondhead 60°
- e-box
Modifications possible upon request
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 18 |
| Last activity | June 27, 2026 |
Wire Bonder
Hesse BJ820
Vers. 1
Current configuration:
- Wedge-wedge,
- Bondhead 60°
- e-box
Modifications possible upon request
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
The Hesse Mechatronics BJ820 is a semiconductor wire bonder designed for precision wedge-wedge bonding applications. Manufactured in 2008, this model features a bondhead angled at 60°, which supports detailed and accurate bonding processes. The machine is equipped with an e-box and is presented in a green and white enclosure, securely mounted on a wooden pallet for transport or storage.
The BJ820 includes a control panel located on the right side, featuring a keyboard, a red emergency stop button, and multiple control buttons, allowing for comprehensive user interaction and operational control. On the left side, a large display screen provides clear visualization of machine settings and calibration data.
Visible through a transparent window on the front, the internal bonding mechanism allows for easy monitoring of the bonding process. The screen displays calibration parameters such as bondhead frequency at 94 kHz, bondforce characteristics including force constant and spring tension, and precise camera settings for focus and pixel ratios, indicating the machine's capability for fine adjustments.
Graphs shown on the display present bondforce versus voltage and ultrasonic current versus frequency, reflecting the machine's detailed calibration status and ultrasonic current resonance for optimal bonding performance.
The machine appears clean and in good physical condition with no visible damage, suggesting careful maintenance. Modifications to the configuration can be made upon request to suit specific production needs. This wire bonder is suitable for semiconductor manufacturing environments requiring reliable and precise wedge bonding.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 18 |
| Last activity | June 27, 2026 |
Hesse Мехатроника Hesse Bondjet BJ820 версия 1
Hesse Mechatronics Hesse Bondjet BJ820 verze 1
Hesse Mekatronik Hesse Bondjet BJ820 version 1
Hesse Mechatronik Hesse Bondjet BJ820 Version 1
Hesse Μηχατρονική Hesse Bondjet BJ820 έκδοση 1
Hesse Mechatronics Hesse Bondjet BJ820 vers.1
Hesse Mecatrónica Hesse Bondjet BJ820 vers.1
Hesse Mécatronique Hesse Bondjet BJ820 vers.1
Hesse Mehatronika Hesse Bondjet BJ820 verzija 1
Hesse Mechatronika Hesse Bondjet BJ820 ver.1
Hesse Meccatronica Hesse Bondjet BJ820 vers.1
Hesse Mechatronika Hesse Bondjet BJ820 vers.1
Hesse Mechatronica Hesse Bondjet BJ820 versie 1
Hesse Mechatronika Hesse Bondjet BJ820 wersja 1
Hesse Mecatrônica Hesse Bondjet BJ820 vers.1
Hesse Mecatronică Hesse Bondjet BJ820 vers.1
Hesse Мехатроника Hesse Bondjet BJ820 вер.1
Hesse Мехатроника Hesse Bondjet BJ820 верзија 1
Hesse Mekatronik Hesse Bondjet BJ820 version 1
Hesse Mekatronik Hesse Bondjet BJ820 versiyon 1
EN
- Languages
English (GB)