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| Manufacturer | Hesse Mechatronics |
|---|---|
| Model | BJ820 |
| Year | 2013 |
| Location | Switzerland
|
This listing is for a Hesse Mechatronics BJ820 Wire Bonder, manufactured in 2013. The machine is designed for precise wire bonding applications and features a wedge-wedge bonding technique, which is commonly used in microelectronics for creating reliable wire connections. The bondhead is set at a 60° angle, facilitating specific bonding processes that may require this orientation. Additionally, the machine includes an e-box, which is likely an electronic control unit essential for operating the wire bonder.
The BJ820 model is known for its precision and adaptability in wire bonding tasks. Although exact dimensions, weight, and workpiece capacities are not provided, the machine's configuration suggests it is suitable for a variety of bonding applications. Modifications to the machine can be made upon request, allowing customization to better fit specific production needs.
This wire bonder is categorized under Electrical Discharge Machining (EDM) - Wire cutting EDM machines, indicating it may be integrated or compatible with EDM processes, although this listing focuses on its wire bonding capabilities. No additional accessories or components are listed or visible, and there is no information about the machine's operational condition or testing status.
Potential buyers looking for a reliable wire bonding machine with a wedge-wedge bonding method and a 60° bondhead angle may find the Hesse Mechatronics BJ820 suitable for their manufacturing or research requirements. Further inquiries about modifications and detailed specifications are encouraged to ensure the machine meets specific application needs.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
Wire Bonder
Hesse BJ820
Vers. 1
Current configuration:
- Wedge-wedge,
- Bondhead 60°
- e-box
Modifications possible upon request
Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 18 |
| Last activity | Oct. 16, 2026 |
Wire Bonder
Hesse BJ820
Vers. 1
Current configuration:
- Wedge-wedge,
- Bondhead 60°
- e-box
Modifications possible upon request
Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.
This listing is for a Hesse Mechatronics BJ820 Wire Bonder, manufactured in 2013. The machine is designed for precise wire bonding applications and features a wedge-wedge bonding technique, which is commonly used in microelectronics for creating reliable wire connections. The bondhead is set at a 60° angle, facilitating specific bonding processes that may require this orientation. Additionally, the machine includes an e-box, which is likely an electronic control unit essential for operating the wire bonder.
The BJ820 model is known for its precision and adaptability in wire bonding tasks. Although exact dimensions, weight, and workpiece capacities are not provided, the machine's configuration suggests it is suitable for a variety of bonding applications. Modifications to the machine can be made upon request, allowing customization to better fit specific production needs.
This wire bonder is categorized under Electrical Discharge Machining (EDM) - Wire cutting EDM machines, indicating it may be integrated or compatible with EDM processes, although this listing focuses on its wire bonding capabilities. No additional accessories or components are listed or visible, and there is no information about the machine's operational condition or testing status.
Potential buyers looking for a reliable wire bonding machine with a wedge-wedge bonding method and a 60° bondhead angle may find the Hesse Mechatronics BJ820 suitable for their manufacturing or research requirements. Further inquiries about modifications and detailed specifications are encouraged to ensure the machine meets specific application needs.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 18 |
| Last activity | Oct. 16, 2026 |
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