Contact us to receive an offer.
| Manufacturer | Hesse Mechatronics |
|---|---|
| Model | BJ820 |
| Year | 2014 |
| Location | Switzerland
|
This listing is for a Hesse BJ820 Wire Bonder, Version 2, designed for semiconductor manufacturing and assembly applications. The machine is currently configured with a wedge-wedge bonding method, which is suitable for creating reliable wire connections in microelectronic devices. It features a bondhead set at a 60-degree angle, allowing precise control during the bonding process. Additionally, the unit includes an e-box, which is typically an electronic control box integral to the operation of the wire bonder.
The Hesse BJ820 is known for its application in semiconductor packaging and wire bonding tasks, providing consistent performance in joining fine wires to semiconductor components. This particular version and configuration enable it to handle specific bonding requirements, making it a versatile tool in electronic manufacturing.
Modifications to the machine can be accommodated upon request, allowing customization to better fit specific production needs or integration into existing manufacturing lines. Potential buyers interested in adapting the wire bonder for specialized tasks should inquire about available modification options.
Please note that no additional accessories or components are specified in the current description, and no images are provided to further detail the condition or included parts of the equipment. Prospective purchasers are encouraged to request further information or clarification regarding the machine's operational status, included accessories, and any available service history to ensure it meets their requirements.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
Wire Bonder
Hesse BJ820
Vers. 2
Current configuration:
- Wedge-wedge,
- Bondhead 60°
- e-box
Modifications possible upon request.
Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 18 |
| Last activity | Oct. 16, 2026 |
Wire Bonder
Hesse BJ820
Vers. 2
Current configuration:
- Wedge-wedge,
- Bondhead 60°
- e-box
Modifications possible upon request.
Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.
This listing is for a Hesse BJ820 Wire Bonder, Version 2, designed for semiconductor manufacturing and assembly applications. The machine is currently configured with a wedge-wedge bonding method, which is suitable for creating reliable wire connections in microelectronic devices. It features a bondhead set at a 60-degree angle, allowing precise control during the bonding process. Additionally, the unit includes an e-box, which is typically an electronic control box integral to the operation of the wire bonder.
The Hesse BJ820 is known for its application in semiconductor packaging and wire bonding tasks, providing consistent performance in joining fine wires to semiconductor components. This particular version and configuration enable it to handle specific bonding requirements, making it a versatile tool in electronic manufacturing.
Modifications to the machine can be accommodated upon request, allowing customization to better fit specific production needs or integration into existing manufacturing lines. Potential buyers interested in adapting the wire bonder for specialized tasks should inquire about available modification options.
Please note that no additional accessories or components are specified in the current description, and no images are provided to further detail the condition or included parts of the equipment. Prospective purchasers are encouraged to request further information or clarification regarding the machine's operational status, included accessories, and any available service history to ensure it meets their requirements.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 18 |
| Last activity | Oct. 16, 2026 |
Полупроводникова машина Hesse Mechatronics BJ820
Polovodičový stroj Hesse Mechatronics BJ820
Hesse Mechatronics BJ820 Halvledermaskine
Hesse Mechatronics BJ820 Halbleitermaschine
Μηχανή ημιαγωγών Hesse Mechatronics BJ820
Hesse Mechatronics BJ820 Semiconductor machine
Máquina de semiconductores Hesse Mechatronics BJ820
Machine à semi-conducteurs Hesse Mechatronics BJ820
Poluvodički stroj Hesse Mechatronics BJ820
Hesse Mechatronics BJ820 Félvezető gép
Macchine a semiconduttore Hesse Mechatronics BJ820
Hesse Mechatronics BJ820 Puslaidininkinė mašina
Hesse Mechatronics BJ820 Halfgeleidermachine
Maszyna półprzewodnikowa Hesse Mechatronics BJ820
Máquina semicondutora Hesse Mechatronics BJ820
Mașină semiconductoare Hesse Mechatronics BJ820
Hesse Mechatronics BJ820 Полупроводниковая машина
Poluprovodnička mašina Hesse Mechatronics BJ820
Hesse Mechatronics BJ820 Halvledarmaskin
Yarı iletken makinesi Hesse Mechatronics BJ820
EN
- Languages
English (GB)