Hesse Mechatronics BJ820 Semiconductor machine

Verified seller

Price on request

Make an offer
  • - Secured payment for the purchase
  • - Dedicated compliance check of the seller
  • - Logistics and customs support if applicable
  • - After-sale follow up if needed

Contact us to receive an offer.

Manufacturer Hesse Mechatronics
Model BJ820
Year 2013
Location Switzerland CH
Jérémie
Your dedicated contact
Jérémie R.

Automatic description (AI-Generated)

The Hesse Mechatronics BJ820 is a wire Electrical Discharge Machining (EDM) machine designed for precision wire bonding applications. This model, manufactured in 2013, features a wedge-wedge bonding configuration with a bondhead angled at 60 degrees, suitable for intricate bonding tasks. The machine's exterior is finished in green and white, providing a professional and clean appearance.

The front panel of the BJ820 is equipped with a comprehensive control interface, including a keyboard, numeric keypad, joystick, and prominently placed emergency stop button for safety. Additionally, a key switch labeled 'A-MODE' alongside start and stop buttons offers straightforward machine operation. Two large viewing windows on the front allow for clear monitoring of the machining area during operations.

The control system includes a large monitor mounted on an adjustable arm, facilitating ease of use and visibility. The user interface displays detailed calibration settings such as bondhead frequency at 95 kHz and wire type of 38 micrometers. Bondforce parameters, including force constants and spring tensions, are also accessible, enabling precise adjustments to bonding conditions.

The machine's software supports manual bonding with visual aids like images of wire bonds and measurement lines, alongside navigation options for production, setup, programming, administration, and service. This comprehensive interface allows operators to load, edit, and manage bond parameters efficiently.

Internally, the electrical cabinet houses multiple circuit boards, relays, and cooling fans arranged neatly, reflecting organized internal component management. The machine is currently positioned on a wooden pallet, ready for transport or installation. Modifications to the machine configuration can be made upon request to better suit specific operational needs.

The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.

Seller's description

Wire Bonder

Hesse BJ820

Vers. 1

Current configuration:

- Wedge-wedge,
- Bondhead 60°
- e-box

Modifications possible upon request

Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.


Client type Machinery dealer
Active since 2019
Offers online 18
Last activity Oct. 16, 2026

Seller's description

Wire Bonder

Hesse BJ820

Vers. 1

Current configuration:

- Wedge-wedge,
- Bondhead 60°
- e-box

Modifications possible upon request

Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.



Automatic description (AI-Generated)

The Hesse Mechatronics BJ820 is a wire Electrical Discharge Machining (EDM) machine designed for precision wire bonding applications. This model, manufactured in 2013, features a wedge-wedge bonding configuration with a bondhead angled at 60 degrees, suitable for intricate bonding tasks. The machine's exterior is finished in green and white, providing a professional and clean appearance.

The front panel of the BJ820 is equipped with a comprehensive control interface, including a keyboard, numeric keypad, joystick, and prominently placed emergency stop button for safety. Additionally, a key switch labeled 'A-MODE' alongside start and stop buttons offers straightforward machine operation. Two large viewing windows on the front allow for clear monitoring of the machining area during operations.

The control system includes a large monitor mounted on an adjustable arm, facilitating ease of use and visibility. The user interface displays detailed calibration settings such as bondhead frequency at 95 kHz and wire type of 38 micrometers. Bondforce parameters, including force constants and spring tensions, are also accessible, enabling precise adjustments to bonding conditions.

The machine's software supports manual bonding with visual aids like images of wire bonds and measurement lines, alongside navigation options for production, setup, programming, administration, and service. This comprehensive interface allows operators to load, edit, and manage bond parameters efficiently.

Internally, the electrical cabinet houses multiple circuit boards, relays, and cooling fans arranged neatly, reflecting organized internal component management. The machine is currently positioned on a wooden pallet, ready for transport or installation. Modifications to the machine configuration can be made upon request to better suit specific operational needs.

The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.


About this seller

Client type Machinery dealer
Active since 2019
Offers online 18
Last activity Oct. 16, 2026

Here is a selection of similar machines - Hesse Mechatronics BJ820

Hesse Mechatronics BJ820 Semiconductor machine