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| Manufacturer | Forma makina |
|---|---|
| Model | GK |
| Year | 2014 |
| Location | Bulgaria
|
This listing is for a Forma Makina GK automatic wafer cutting machine, manufactured in 2014. The machine is designed for precise wafer cutting operations and features a double channel system capable of handling wafer sizes of 350 mm and 500 mm. It is equipped with a conveyor that is 500 mm wide and 2.5 meters long, facilitating efficient wafer transport during the cutting process. The overall dimensions of the machine measure approximately 2500 mm in length and 500 mm in width, making it suitable for industrial environments with space considerations.
The machine operates with a power rating of 4.5 kW and requires an air pressure input of 6 BAR, indicating pneumatic components are part of its operation. The manufacturer, Forma Makina, is identified clearly on the machine along with the model number GK and the production year 2014, ensuring traceability and authenticity.
This wafer cutting machine is intended for use in confectionery or similar industries where wafer products are produced. Its dual channel capability allows for simultaneous processing of wafers with two different widths, enhancing productivity. The conveyor system supports continuous operation by moving wafers smoothly through the cutting area.
No additional accessories or specific condition details are provided. Prospective buyers should consider the machine's specifications and confirm compatibility with their production requirements. This equipment is a robust solution for wafer cutting tasks in medium to large-scale manufacturing setups.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
Automatic Wafer Cutting Machine
16 wafers, double channel 350/500 mm + conveyor 500 mm wide and 2,5 m long
Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.
| Client type | Factory – large company |
| Active since | 2025 |
| Offers online | 37 |
| Last activity | Oct. 31, 2026 |
Automatic Wafer Cutting Machine
16 wafers, double channel 350/500 mm + conveyor 500 mm wide and 2,5 m long
Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.
This listing is for a Forma Makina GK automatic wafer cutting machine, manufactured in 2014. The machine is designed for precise wafer cutting operations and features a double channel system capable of handling wafer sizes of 350 mm and 500 mm. It is equipped with a conveyor that is 500 mm wide and 2.5 meters long, facilitating efficient wafer transport during the cutting process. The overall dimensions of the machine measure approximately 2500 mm in length and 500 mm in width, making it suitable for industrial environments with space considerations.
The machine operates with a power rating of 4.5 kW and requires an air pressure input of 6 BAR, indicating pneumatic components are part of its operation. The manufacturer, Forma Makina, is identified clearly on the machine along with the model number GK and the production year 2014, ensuring traceability and authenticity.
This wafer cutting machine is intended for use in confectionery or similar industries where wafer products are produced. Its dual channel capability allows for simultaneous processing of wafers with two different widths, enhancing productivity. The conveyor system supports continuous operation by moving wafers smoothly through the cutting area.
No additional accessories or specific condition details are provided. Prospective buyers should consider the machine's specifications and confirm compatibility with their production requirements. This equipment is a robust solution for wafer cutting tasks in medium to large-scale manufacturing setups.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Factory – large company |
| Active since | 2025 |
| Offers online | 37 |
| Last activity | Oct. 31, 2026 |
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