Koh Young KY8030-3

The Koh Young KY8030-3 is a high-speed True 3D Solder Paste Inspection (SPI) system designed for precise and reliable inspection of solder paste printing in SMT and PCB assembly production. The system uses Koh Young's patented 3D dual-projection technology to minimize shadow and reflection problems and provide accurate, repeatable measurement data. Its Z-tracking 3D compensation technology also compensates for PCB warpage to improve inspection reliability. The KY8030-3 is suitable for high-volume electronics manufacturing and can inspect solder paste volume, height, area, offset, bridging and other printing defects. Key Features: Manufacturer: Koh Young Model: KY8030-3 Equipment Type: True 3D Solder Paste Inspection (SPI) Application: SMT / PCB Assembly 3D Measurement Technology Dual-direction projection Active PCB Warp Compensation Automatic Conveyor Width Adjustment 01005 component inspection capability SPC Plus process control Gerber and ODB++ data support ePM-SPI programming software Windows operating system Inspection Capabilities: Insufficient solder paste Excessive solder paste Missing solder paste Solder paste offset Solder bridging Shape deformation Coplanarity Solder paste volume, area and height measurement PCB warpage compensation Condition: Used / Good Working Condition The machine can be inspected and tested before shipment. Photos, videos, technical specifications and quotation are available upon request. Please contact us for price, availability and …