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| Manufacturer | Omron |
|---|---|
| Model | CKD VP-01G |
| Year | 2016 |
| Location | Germany
|
Omron CKD VP-01G PCB inspection machine, manufactured in 2016. The machine is described as an inline 3D solder paste inspection system for circuit boards. It measures solder paste deposits to identify issues such as insufficient volume, offset, coverage, and profile defects. The same inspection approach can also be used for adhesive deposits.
The system offers standard, high, and very high resolution settings, with automatic switching to balance inspection speed and measurement detail across different board areas. Its 3D topographic display uses false colors to present paste deposits, while graphical process-analysis tools, including Gaussian curves and a bullseye chart, help show deviations. The supplied description also specifies Closed Loop communication of detected printing deviations to a printer for incremental adjustment, and Loop Forward data transfer to a downstream placement machine for component-positioning adjustments.
Process data can be linked with Omron AOI and AXI solutions. An integrated statistical process control function analyzes measurement values, and the description states that statistical data is collected in accordance with ISO 9001 and IATF 16949:2016.
The enclosed machine has a large front access door, a lower dark rectangular viewing window, and a monitor mounted on the upper front displaying a graphical interface. A red, yellow, and green signal tower is mounted on top, and warning symbols are present on the front. The stated dimensions are 938.0 mm long, 1191.0 mm wide, and 1480.0 mm high.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
CKD VP9000: 3D solder paste inspection directly on the line
Omron’s CKD VP9000 inline SPI system reliably and accurately inspects solder paste deposits on circuit boards in 3D. It detects deviations early, keeps the printing process under control, and improves the quality of subsequent manufacturing steps.
More than 2D: Monitor volume and profile
Unlike conventional 2D systems, the VP9000 does more than check whether solder paste is present, how far it is offset, and how much area it covers. It also detects insufficient volume and defective profiles in individual paste deposits. The same method can also be used to inspect adhesive dots.
Multiple Resolution Switch: Balancing speed and accuracy
The system automatically and flexibly switches between standard, high, and very high resolution. This lets you choose the best balance of inspection speed and measurement accuracy for each area of the circuit board.
Spot defects at a glance
Topographic 3D display: Paste deposits are visualized in false colors, making printing defects immediately visible.
Graphical process analysis: Gaussian bell curves and a bullseye chart clearly illustrate process deviations.
Closed Loop and Loop Forward
In inline operation, the VP9000 sends detected solder paste printing deviations directly to the printer (Closed Loop), which then makes incremental adjustments. The downstream placement machine also receives the data (Loop Forward) and can adjust component positioning accordingly.
Comprehensive process control
Process data can be linked with OMRON AOI and AXI solutions, providing an effective tool for monitoring the entire production line. The integrated SPC function continuously performs statistical analysis of measurement values and helps further optimize the printing process.
Statistical data is collected in accordance with ISO 9001 and IATF 16949:2016.
Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.
| Client type | Machinery dealer |
| Active since | 2024 |
| Offers online | 28 |
| Last activity | Nov. 13, 2026 |
CKD VP9000: 3D solder paste inspection directly on the line
Omron’s CKD VP9000 inline SPI system reliably and accurately inspects solder paste deposits on circuit boards in 3D. It detects deviations early, keeps the printing process under control, and improves the quality of subsequent manufacturing steps.
More than 2D: Monitor volume and profile
Unlike conventional 2D systems, the VP9000 does more than check whether solder paste is present, how far it is offset, and how much area it covers. It also detects insufficient volume and defective profiles in individual paste deposits. The same method can also be used to inspect adhesive dots.
Multiple Resolution Switch: Balancing speed and accuracy
The system automatically and flexibly switches between standard, high, and very high resolution. This lets you choose the best balance of inspection speed and measurement accuracy for each area of the circuit board.
Spot defects at a glance
Topographic 3D display: Paste deposits are visualized in false colors, making printing defects immediately visible.
Graphical process analysis: Gaussian bell curves and a bullseye chart clearly illustrate process deviations.
Closed Loop and Loop Forward
In inline operation, the VP9000 sends detected solder paste printing deviations directly to the printer (Closed Loop), which then makes incremental adjustments. The downstream placement machine also receives the data (Loop Forward) and can adjust component positioning accordingly.
Comprehensive process control
Process data can be linked with OMRON AOI and AXI solutions, providing an effective tool for monitoring the entire production line. The integrated SPC function continuously performs statistical analysis of measurement values and helps further optimize the printing process.
Statistical data is collected in accordance with ISO 9001 and IATF 16949:2016.
Please note that this description may have been translated or optimized with artificial intelligence (AI) automatically. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase.
Omron CKD VP-01G PCB inspection machine, manufactured in 2016. The machine is described as an inline 3D solder paste inspection system for circuit boards. It measures solder paste deposits to identify issues such as insufficient volume, offset, coverage, and profile defects. The same inspection approach can also be used for adhesive deposits.
The system offers standard, high, and very high resolution settings, with automatic switching to balance inspection speed and measurement detail across different board areas. Its 3D topographic display uses false colors to present paste deposits, while graphical process-analysis tools, including Gaussian curves and a bullseye chart, help show deviations. The supplied description also specifies Closed Loop communication of detected printing deviations to a printer for incremental adjustment, and Loop Forward data transfer to a downstream placement machine for component-positioning adjustments.
Process data can be linked with Omron AOI and AXI solutions. An integrated statistical process control function analyzes measurement values, and the description states that statistical data is collected in accordance with ISO 9001 and IATF 16949:2016.
The enclosed machine has a large front access door, a lower dark rectangular viewing window, and a monitor mounted on the upper front displaying a graphical interface. A red, yellow, and green signal tower is mounted on top, and warning symbols are present on the front. The stated dimensions are 938.0 mm long, 1191.0 mm wide, and 1480.0 mm high.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Machinery dealer |
| Active since | 2024 |
| Offers online | 28 |
| Last activity | Nov. 13, 2026 |
Spain
2012
Spain
2014
Germany
2014
| Type | PCB |
|---|
Estonia
2019
Turkey
2020
Portugal
2007
Portugal
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