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Saki BF-3Di Inspection machine for electronics

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Saki BF-3Di - 3D Automated Optical Inspection Machine
Brand: Saki
Model: BF-3Di
Year: 2015
Software Version: BF2(3Di)_2.2.0.10
Diagram No: SJ265A00W
Windows 7 Professional OS
Horizontal Resolution: 18um
Height Resolution: 1 um
PCB Size: 50x60 - 460x510 mm (1.97 x 2.36 to 18.11 x 20.08 in)
PCB Thickness: 0.6 to 3.2mm (0.02 to 0.13 in)
Inspection categories: Presence/Absence, Misalignment, Tombstone, Reverse, Polarity, Bridge, Absence of Solder, Insufficient Solder, Lifted Lead, Lifted Chip, and Filler Defect
Camera (image capture) CMOS Area Camera
Lighting: 4-way Projection System with Multistage Ring Light
FOV Size: 36mm x 36mm (1.42 in x 1.42 in)
Electrical Requirements: ~200-240V 50/60 Hz 1300 VA
Image Capturing Time: 2D: Approx. 4.3 FOV/sec., 3D: Approx. 2.1 FOV/sec.
PCB Load/Unload Time: Approx. 5 sec.
Conveyor Method: Flat Belt Transfer
Conveyor Height: 880 to 920 mm (34.65 to 36.22 in.)
Width Adjustment: Automatic
SCCR: 2.5kA
Air Req.: 0.5MPa 5L/min (ANR)
Dimensions
W x D x H: 1040 x 1440 x 1470 mm (40.94 x 56.69 x 57.87 in.)
Weight Approx. 870 kg (1,918 lbs.)
CE Marked

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. Exapro recommends to check the details with the seller before a purchase

Type PCB
-------------------
Length x width x height 1040.0 × 1440.0 × 1470.0
Weight 870 kg
Worked hours
Hours under power
State good
At local norms ---------
Status visible
Client type Reseller
Active since 2020
Offers online 36
Last activity March 28, 2024

Description

Saki BF-3Di - 3D Automated Optical Inspection Machine
Brand: Saki
Model: BF-3Di
Year: 2015
Software Version: BF2(3Di)_2.2.0.10
Diagram No: SJ265A00W
Windows 7 Professional OS
Horizontal Resolution: 18um
Height Resolution: 1 um
PCB Size: 50x60 - 460x510 mm (1.97 x 2.36 to 18.11 x 20.08 in)
PCB Thickness: 0.6 to 3.2mm (0.02 to 0.13 in)
Inspection categories: Presence/Absence, Misalignment, Tombstone, Reverse, Polarity, Bridge, Absence of Solder, Insufficient Solder, Lifted Lead, Lifted Chip, and Filler Defect
Camera (image capture) CMOS Area Camera
Lighting: 4-way Projection System with Multistage Ring Light
FOV Size: 36mm x 36mm (1.42 in x 1.42 in)
Electrical Requirements: ~200-240V 50/60 Hz 1300 VA
Image Capturing Time: 2D: Approx. 4.3 FOV/sec., 3D: Approx. 2.1 FOV/sec.
PCB Load/Unload Time: Approx. 5 sec.
Conveyor Method: Flat Belt Transfer
Conveyor Height: 880 to 920 mm (34.65 to 36.22 in.)
Width Adjustment: Automatic
SCCR: 2.5kA
Air Req.: 0.5MPa 5L/min (ANR)
Dimensions
W x D x H: 1040 x 1440 x 1470 mm (40.94 x 56.69 x 57.87 in.)
Weight Approx. 870 kg (1,918 lbs.)
CE Marked

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. Exapro recommends to check the details with the seller before a purchase


Specifications

Type PCB
-------------------
Length x width x height 1040.0 × 1440.0 × 1470.0
Weight 870 kg
Worked hours
Hours under power
State good
At local norms ---------
Status visible

About this seller

Client type Reseller
Active since 2020
Offers online 36
Last activity March 28, 2024