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| Manufacturer | Rehm |
|---|---|
| Model | Compact Nitro 2300 |
| Year | 2004 |
| Location | Czech Republic
|
| Category | PCB - Reflow ovens |
| Power supply (Volts) | 400 V |
| Cooling unit | Yes |
| Weight | 2000 kg |
| worked hours | |
| hours under power | |
| state | excellent |
| At local norms | --------- |
| status | |
| Last availability date | 12/01/2026 |
| Product id | P211208021 |
| Language |
Rehm Compact Nitro 2300
Horkovzdušná přetavovací pec Rehm Compact Nitro 2300/400
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300 PCB Reflow Öfen
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300 PCB Reflow oven
Horno de reflujo PCB Rehm Compact Nitro 2300
Four à refusion PCB Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
Forno di rifusione Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
Piec przelotowy PCB Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300 Решетчатая печь для печатной платы
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
PCB reflow fırını Rehm Compact Nitro 2300
|
This Rehm Compact Nitro 2300 is an industrial reflow oven designed for soldering printed circuit boards, including SMD and composite designs, as well as for drying SMD adhesive. Manufactured in 2004, the machine weighs approximately 2000 kg and operates on a 400 V power supply. It features a cooling unit to support its operation.
The oven is capable of reaching temperatures between 200 and 210 °C, with a maximum transfer speed of 1000 mm per minute. It has a total power consumption of 50 kW. The system can be integrated into a production line, enhancing manufacturing efficiency.
Technical specifications include the possibility of inert gas use, specifically nitrogen, at a flow rate of 30 m³/h with an overpressure of 6 to 10 bar. Water demand is specified at 20 liters per minute with an overpressure between 2 and 5 bar. The exhaust volume is rated at 1000 m³ per hour, supporting proper ventilation during operation.
The machine has a long rectangular design with multiple access panels on the front for maintenance and operation. A control panel equipped with a screen and buttons is located on the left side, allowing for user interface and machine control. Ventilation ducts and pipes are positioned on the floor in front of the machine, likely serving exhaust or air circulation purposes. An emergency stop button is installed on the right side to ensure safety during operation.
The unit is situated in a clean indoor environment with a tiled floor and ample natural light through large windows, indicating good maintenance conditions. This reflow oven is suitable for industrial settings requiring precise soldering and drying processes for PCB manufacturing.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
temperature: 200-210 ° C
transfer speed: max. 1000 mm / min
total power consumption: 50 kw
Soldering equipment for printed circuit boards (eg Type: SMD and / or composite design) and SMD drying adhesive.
Can be integrated into a production line.
Further technical details:
- possibility of inert gas with nitrogen 30 m³ / h; 6 - 10 bar overpressure
- water demand: 20 liters / min; 2 - 5 bar overpressure
- exhaust volume: 1000 m³ / h
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
When was this Rehm Compact Nitro 2300 manufactured?
This Rehm Compact Nitro 2300 PCB Reflow oven was manufactured in 2004.
Is this equipment currently disassembled?
This equipment is currently disassembled and preserved.
What is the condition of this Rehm Compact Nitro 2300?
This Rehm Compact Nitro 2300 PCB Reflow oven is in very good condition.
What is the maximum operating temperature of this equipment?
This equipment has a maximum operating temperature, although the specific value is not provided.
The following questions and answers are generated using artificial intelligence based on the product information available. They are provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Factory – small or medium company |
| Active since | 2021 |
| Offers online | 1 |
| Last activity | June 26, 2024 |
temperature: 200-210 ° C
transfer speed: max. 1000 mm / min
total power consumption: 50 kw
Soldering equipment for printed circuit boards (eg Type: SMD and / or composite design) and SMD drying adhesive.
Can be integrated into a production line.
Further technical details:
- possibility of inert gas with nitrogen 30 m³ / h; 6 - 10 bar overpressure
- water demand: 20 liters / min; 2 - 5 bar overpressure
- exhaust volume: 1000 m³ / h
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
When was this Rehm Compact Nitro 2300 manufactured?
This Rehm Compact Nitro 2300 PCB Reflow oven was manufactured in 2004.
Is this equipment currently disassembled?
This equipment is currently disassembled and preserved.
What is the condition of this Rehm Compact Nitro 2300?
This Rehm Compact Nitro 2300 PCB Reflow oven is in very good condition.
What is the maximum operating temperature of this equipment?
This equipment has a maximum operating temperature, although the specific value is not provided.
The following questions and answers are generated using artificial intelligence based on the product information available. They are provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Category | PCB - Reflow ovens |
| Power supply (Volts) | 400 V |
| Cooling unit | Yes |
| Weight | 2000 kg |
| worked hours | |
| hours under power | |
| state | excellent |
| At local norms | --------- |
| status | |
| Last availability date | 12/01/2026 |
| Product id | P211208021 |
| Language |
Rehm Compact Nitro 2300
Horkovzdušná přetavovací pec Rehm Compact Nitro 2300/400
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300 PCB Reflow Öfen
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300 PCB Reflow oven
Horno de reflujo PCB Rehm Compact Nitro 2300
Four à refusion PCB Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
Forno di rifusione Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
Piec przelotowy PCB Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300 Решетчатая печь для печатной платы
Rehm Compact Nitro 2300
Rehm Compact Nitro 2300
PCB reflow fırını Rehm Compact Nitro 2300
|
This Rehm Compact Nitro 2300 is an industrial reflow oven designed for soldering printed circuit boards, including SMD and composite designs, as well as for drying SMD adhesive. Manufactured in 2004, the machine weighs approximately 2000 kg and operates on a 400 V power supply. It features a cooling unit to support its operation.
The oven is capable of reaching temperatures between 200 and 210 °C, with a maximum transfer speed of 1000 mm per minute. It has a total power consumption of 50 kW. The system can be integrated into a production line, enhancing manufacturing efficiency.
Technical specifications include the possibility of inert gas use, specifically nitrogen, at a flow rate of 30 m³/h with an overpressure of 6 to 10 bar. Water demand is specified at 20 liters per minute with an overpressure between 2 and 5 bar. The exhaust volume is rated at 1000 m³ per hour, supporting proper ventilation during operation.
The machine has a long rectangular design with multiple access panels on the front for maintenance and operation. A control panel equipped with a screen and buttons is located on the left side, allowing for user interface and machine control. Ventilation ducts and pipes are positioned on the floor in front of the machine, likely serving exhaust or air circulation purposes. An emergency stop button is installed on the right side to ensure safety during operation.
The unit is situated in a clean indoor environment with a tiled floor and ample natural light through large windows, indicating good maintenance conditions. This reflow oven is suitable for industrial settings requiring precise soldering and drying processes for PCB manufacturing.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Factory – small or medium company |
| Active since | 2021 |
| Offers online | 1 |
| Last activity | June 26, 2024 |
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