| Manufacturer | Karl Suss |
|---|---|
| Model | RA120M |
| Year | |
| Location | USA
|
The Karl Suss RA120M is a precision wafer scribing system designed for wafers up to 4 inches (102 mm) in diameter and substrates as large as 4 inches square. It features two independently programmable scribing axes, allowing for versatile operation tailored to specific scribing requirements. Users can input parameters in either metric (microns) or inch (mils) units, selectable via an internal mode jumper before powering up. The system supports fine data input increments of 1 micron in metric mode and 0.1 mil in inch mode.
The RA120M offers three distinct scribing modes to accommodate different materials and device fabrication needs. In continuous scribe mode, the system produces an uninterrupted scribe across the entire length of the wafer or substrate to the programmed depth. The edge scribe mode enables scribing a short distance inward from the material's edge, with scribe lengths adjustable in 1 micron increments between 20 and 10,000 microns. After completing an edge scribe, the table automatically indexes to start the next scribe, enhancing throughput by minimizing table movement.
The skip scribe mode is ideal for applications where intersecting scribes could interfere with device operation. In this mode, the scribing tool engages during the scribe length movement, then lifts as the table moves a specified distance before the next scribe begins. Both scribe length and skip distances are user-programmable within the 20 to 10,000 micron range.
The system includes a microscope assembly with binocular eyepieces and objective lenses for precise viewing, along with a mechanical stage featuring orange and black wafer positioning components. Control buttons labeled with directional commands (RIGHT, LEFT, FAST, SLOW) and a MARK button facilitate manual adjustments. The equipment appears clean and in good physical condition with no visible damage, supporting reliable operation in semiconductor wafer scribing applications.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
The RA 120M permits scribing of wafers up to 4 inches (102 mm) in diameter and substrates as large as 4 inches (102 mm) square.
Two independent scribing axes are separately programmable for maximum versatility.
Parameters can be entered in either microns or mils. (Inch or metric mode is selected before power up by positioning an internal mode jumper.)
Data input increments are 1 micron in the metric mode, and 0.1 mil in inches.
The RA 120M provides three distinct scribing modes and two separate scribing axes so that you can optimize the specific configuration best suited to your need. The choice depends upon the compound being scribed and the particular device type that is fabricated on the wafer or substrate.
If the continuous scribe program is selected, the scriber will produce an uninterrupted scribe across the entire length of the material, to the depth programmed during setup. The edge scribe mode allows the RA 120M to scribe a small distance in from the edge of the material.
The scribe length is operator selectable in 1 micron increments between 20 and 10,000 microns, and the beginning of the scribe is always relative to the edge of the material. When an edge scribe is finished, the table indexes automatically and the next scribe starts immediately. Therefore this scribe mode is very fast, since the table only moves a small distance in the scribing direction.
Skip scribing is very useful for situations where an intersection of scribes would interfere with proper operation of the device. In the skip scribe mode, the tool is placed in the scribe position while the table moves a specific scribe length distance; the tool is then raised and the table moves a given distance before the next scribe commences. Parameters are user selectable, and skip scribes between 20 and 10,000 microns may be programmed.
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 58 |
| Last activity | June 6, 2026 |
The RA 120M permits scribing of wafers up to 4 inches (102 mm) in diameter and substrates as large as 4 inches (102 mm) square.
Two independent scribing axes are separately programmable for maximum versatility.
Parameters can be entered in either microns or mils. (Inch or metric mode is selected before power up by positioning an internal mode jumper.)
Data input increments are 1 micron in the metric mode, and 0.1 mil in inches.
The RA 120M provides three distinct scribing modes and two separate scribing axes so that you can optimize the specific configuration best suited to your need. The choice depends upon the compound being scribed and the particular device type that is fabricated on the wafer or substrate.
If the continuous scribe program is selected, the scriber will produce an uninterrupted scribe across the entire length of the material, to the depth programmed during setup. The edge scribe mode allows the RA 120M to scribe a small distance in from the edge of the material.
The scribe length is operator selectable in 1 micron increments between 20 and 10,000 microns, and the beginning of the scribe is always relative to the edge of the material. When an edge scribe is finished, the table indexes automatically and the next scribe starts immediately. Therefore this scribe mode is very fast, since the table only moves a small distance in the scribing direction.
Skip scribing is very useful for situations where an intersection of scribes would interfere with proper operation of the device. In the skip scribe mode, the tool is placed in the scribe position while the table moves a specific scribe length distance; the tool is then raised and the table moves a given distance before the next scribe commences. Parameters are user selectable, and skip scribes between 20 and 10,000 microns may be programmed.
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
The Karl Suss RA120M is a precision wafer scribing system designed for wafers up to 4 inches (102 mm) in diameter and substrates as large as 4 inches square. It features two independently programmable scribing axes, allowing for versatile operation tailored to specific scribing requirements. Users can input parameters in either metric (microns) or inch (mils) units, selectable via an internal mode jumper before powering up. The system supports fine data input increments of 1 micron in metric mode and 0.1 mil in inch mode.
The RA120M offers three distinct scribing modes to accommodate different materials and device fabrication needs. In continuous scribe mode, the system produces an uninterrupted scribe across the entire length of the wafer or substrate to the programmed depth. The edge scribe mode enables scribing a short distance inward from the material's edge, with scribe lengths adjustable in 1 micron increments between 20 and 10,000 microns. After completing an edge scribe, the table automatically indexes to start the next scribe, enhancing throughput by minimizing table movement.
The skip scribe mode is ideal for applications where intersecting scribes could interfere with device operation. In this mode, the scribing tool engages during the scribe length movement, then lifts as the table moves a specified distance before the next scribe begins. Both scribe length and skip distances are user-programmable within the 20 to 10,000 micron range.
The system includes a microscope assembly with binocular eyepieces and objective lenses for precise viewing, along with a mechanical stage featuring orange and black wafer positioning components. Control buttons labeled with directional commands (RIGHT, LEFT, FAST, SLOW) and a MARK button facilitate manual adjustments. The equipment appears clean and in good physical condition with no visible damage, supporting reliable operation in semiconductor wafer scribing applications.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 58 |
| Last activity | June 6, 2026 |
Автоматичен писец Karl Suss RA120M
Automatický písař Karl Suss RA120M
Karl Suss RA120M Automatisk skriveredskab
Karl Suss RA120M Automatischer Anreißer
Karl Suss RA120M Αυτόματη γραφομηχανή
Karl Suss RA120M Automatic Scriber
Karl Suss RA120M Trazador automático
Karl Suss RA120M Pointeur automatique
Automatski pisač Karl Suss RA120M
Karl Suss RA120M automata írógép
Karl Suss RA120M Scriba automatico
Karl Suss RA120M automatinis raižytuvas
Karl Suss RA120M Automatische Krabber
Rysik automatyczny Karl Suss RA120M
Escrivão automático Karl Suss RA120M
Karl Suss RA120M Scriber automat
Автоматический писчий станок Karl Suss RA120M
Karl Suss RA120M Automatski Scriber
Karl Suss RA120M Automatisk skrivare
Karl Suss RA120M Otomatik Scriber
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