Heidelberg Suprasetter A75-Gen III computer to plate

Manufacturer Heidelberg
Model Suprasetter A75-Gen III
Year 2013
Location Germany DE
Category CTP computer to plate
Product id P210324058

Price on request

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About this seller

Client type Reseller
Active since 2015
Offers online 6
Last activity Aug. 27, 2021


Max. length 750 mm
Max. width 670 mm
RIP Heidelberg Integration Manager RIP/workflow v.15
Resolution 2540 dpi
Worked hours
Hours under power
State good
At local norms yes
Status visible


Heidelberg Suprasetter A75-GEN III-manual loading, 2013
min. plate size 240 x 240 mm,

max. plate size 750 x 670 mm
1 laser module GEN II, 64 diodes/class 160 mW, 2.540 dpi
to expose thermal metal plates (830 nm)
approx. less than 40.000 plates exposed
Heidelberg Integration Manager RIP/workflow v.15 license with dongle
cleaned, maintained and tested

plate processor on request

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. Exapro recommends to check the details with the seller before a purchase

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