Disco DFD 641 Dicing Saw Wafer machine Verified seller

Price on request

Manufacturer	Disco
Model	DFD 641 Dicing Saw
Year	2000
Location	Unknown country
Category	Semiconductor - Wafer equipment
Product id	P220721033
Language	Disco DFD 641 Dicing Saw Waferovací stroj Disco DFD 641 Dicing Saw Disco DFD 641 Dicing Saw Waferanlage Disco DFD 641 Dicing Saw Wafer machine Máquina para wafer Disco DFD 641 Dicing Saw Machine pour wafer Disco DFD 641 Dicing Saw Disco DFD 641 Dicing Saw Disco DFD 641 Dicing Saw Macchina per wafer Disco DFD 641 Dicing Saw Disco DFD 641 Dicing Saw Maszyna do produkcji płytek półprzewodnikowych Disco DFD 641 Dicing Saw Disco DFD 641 Dicing Saw Disco DFD 641 Dicing Saw Пластина Wafer Makinası Disco DFD 641 Dicing Saw

DIsco DFD 641 Dicing Saw
Refurbished condition, Sold in good working condition

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The Disco DFD 641 Dicing Saw, introduced in 2000, is an advanced and highly efficient electronics machine that has played a crucial role in semiconductor wafer processing. Developed by Disco Corporation, this dicing saw offers exceptional capabilities for precise and reliable wafer dicing, enabling the separation of semiconductor wafers into individual chips with utmost accuracy.

The DFD 641 utilizes innovative diamond blade technology and advanced dicing algorithms to achieve high-precision cuts on semiconductor wafers. Its robust spindle and advanced motion control ensure smooth and stable cutting, minimizing chipping and enhancing the quality of diced chips.

Equipped with a large work area and a versatile chucking system, the dicing saw accommodates wafers of various sizes and materials. This adaptability makes it suitable for a wide range of semiconductor applications, including MEMS devices, power electronics, and microcontrollers.

The machine's user-friendly interface and intuitive software facilitate easy setup and operation. Automated features, such as alignment and pattern recognition, streamline the dicing process and reduce operator dependency.

Despite being introduced in 2000, the Disco DFD 641 Dicing Saw remains a relevant and essential tool in semiconductor manufacturing. Its exceptional precision and efficiency in wafer dicing have contributed to the production of high-quality semiconductor devices, supporting the continuous progress of electronics technology.

In conclusion, the Disco DFD 641 Dicing Saw from 2000 exemplifies precision and innovation in semiconductor wafer processing. Its advanced features and versatile chucking system make it an indispensable asset for electronics manufacturers seeking high-precision and reliable wafer dicing, contributing to the advancement of semiconductor technology and the electronics industry as a whole.

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. Exapro recommends to check the details with the seller before a purchase

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Worked hours
Hours under power
State	good
At local norms	---------
Status

Client type	Reseller
Active since	2010
Offers online	124
Last activity	Sept. 25, 2023

Description

Specifications

-------------------
Worked hours
Hours under power
State	good
At local norms	---------
Status

About this seller

Client type	Reseller
Active since	2010
Offers online	124
Last activity	Sept. 25, 2023

Disco DFD 641 Dicing Saw Wafer machine Verified seller

Description

Specifications

About this seller

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