G&N MPS R40020 Wafer machine

Year: 2011

Thinning machine for silicon wafers up to 12 inches and other semiconductor materials Documentation 200 mm and 100 mm platens. Grinding wheels available.

Used DNS WS820L

Year: 2011

Wafer size = currently configured for square 156mmx156mm (can be reconfigured) Condition: Complete like new working condition, only used during acceptance, no production. Still hooked up in the clean room lab. Additional Options: -Installation services -Rigging, barrier bagging, crating, transportation