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Year: 2011
Thinning machine for silicon wafers up to 12 inches and other semiconductor materials Documentation 200 mm and 100 mm platens. Grinding wheels available.Year: 2011
Wafer size = currently configured for square 156mmx156mm (can be reconfigured) Condition: Complete like new working condition, only used during acceptance, no production. Still hooked up in the clean room lab. Additional Options: -Installation services -Rigging, barrier bagging, crating, transportation