Showing 1 - 15 out of 15
Year: 2011
Thinning machine for silicon wafers up to 12 inches and other semiconductor materials Documentation 200 mm and 100 mm platens. Grinding wheels available.Year:
Karl Suss/CASCADE MICROTECH PA-200HS Semiautomatic Probe System with Complete Accessories (Optional Upgrade for Temperature Measurement Available) Cascade Microtech/Prober/Karl Suss K&S PA200HS Include 4 unit of XYZ Prober Cascade Micro Positioner, Probe Arm and Prober Holder and Isolation Table DESCRIPTION The SUSS PA200 Semiautomatic Probe System is very stable, modular and flexible probe systems for wafers and substrates up to 200 …Year:
Karl Suss PA-200 SemiAutomatic Probe System with Karl Suss PH250HF Probe XYZ Head and Arm & Other Accessories Karl Suss PA 200 with anti-vibration table including 3 units of Karl Suss Manual High Frequency Probe Head (PH250HF) with probe arm and probe head plus 1 unit spare XYZ Edmund Optic Micro Positioners. DESCRIPTION The SUSS PA200 Semiautomatic Probe System is …Year: 1995
Manufacturer Canon Model FPA-1550M4W Year 1995 Wafer size 6 this extra information is standard for this model. Please always double-check the details during a visit The Canon FPA-1550M4W is an advanced and highly specialized electronics machine designed for wafer lithography in semiconductor manufacturing. Developed by Canon Inc., this wafer machine plays a critical role in the production of integrated circuits …Year: 2009
Manufacturer Hitachi Model S-9380II Year 2009 WAFER SIZE 12Year: 2000
Hitachi Kokusai Electric VR-120S 2000 Wafer size 12 this extra information is standard for this model. Please always double-check the details during a visit The Hitachi Kokusai Electric VR-120S Wafer Machine, introduced in 2000, is a highly advanced and specialized pharmaceutical machine designed for thin-film deposition processes in semiconductor manufacturing. Developed by Hitachi Kokusai Electric Inc., this wafer machine plays …Year: 2006
Applied Materials Endura II Liner/Barrier PVD (Physical Vapor Deposition) Currently Configured for 300mm wafer size MFG Date: January, 2006 EQUIPMENT DETAILS: Tool is operating in clean room. A HARD DISK DRIVE WILL BE REMOVED FROM TOOL. [Chamber 2] For Ti PVD chamber DCPS;OPTIMA DCG-200,ENI,for PVD PUMP/CRYO,OBIS,HELIX HT ESC type stageYear: 2001
Tokyo Electron Ltd. NS 300 Wafer Scrubber MFG Date: 2001 EQUIPMENT DETAILS: • Currently Configured for 300mm wafer sizes • (3) 300mm FOUP Load Ports • (1) Cassette Station Arm (CS Arm) • (1) Process Station Arm (PS Arm) • (2) Frontside Scrub Process Stations (F.Scr) • (2) Backside Scrub Process Stations (B.Scr) • (2) Auto Reversing Stations (A.RVS) • …Year: 2013
Tokyo Electron Ltd. TELINDY Plus IRAD Oxide Vertical LPCVD Furnace Currently Configured for 300mm wafer size MFG Date: 2013 EQUIPMENT DETAILS: Inspect to confirm configuration and condition. Configuration : Software Version : Ver.6.07 System Controller is Model 780 The last PM date is 2016/09/24 Off-line date is 2017/11/06 Can produce wafers as is All cables are present Platform Type is …Year: 2013
Manufacturer SEMICS Model OPUS 3 Year 2013 Condition Used Wafer Size 200mmYear:
Aviza Technology, Inc. RVP-300 Vertical Diffusion Furnace Currently Configured for 300mm wafer size EQUIPMENT DETAILS: Process: ANNEAL Tool config is based on original PO, please verify tool details at tool inspection System, General Specification Heater element Model FURNACE,ATM -APL Process Condition AP Maximum Operating Temperature 1200c N2 Load Lock Yes Wafer Type 300 SEMI STD-Notch Qty. of Production Wafers 120 …Year:
Wafer machine Manufacturer Gasonics Model PEP3510 Open CassetteYear:
Manufacturer TEL Model Certas Condition Used Wafer Size 12 inchYear:
APPLIED MICROSTRUCTURES INC MVD 100 The MVD 100 is a useful tool for depositing monolayers of organosilanes. It can be used to create highly hydrophobic surfaces, antifouling surfaces and biofunctionalized surfaces. A list of the monolayer deposition processes used in the system can be found on the tool’s web page. The operation of the system is fairly simple. The tool …Year: 2000
DIsco DFD 641 Dicing Saw Refurbished condition, Sold in good working condition this extra information is standard for this model. Please always double-check the details during a visit The Disco DFD 641 Dicing Saw, introduced in 2000, is an advanced and highly efficient electronics machine that has played a crucial role in semiconductor wafer processing. Developed by Disco Corporation, this …