Showing 1 - 11 out of 11
Year: 2016
Part of KRONES labelling station X (LS X),USEDYear: 2000
DIsco DFD 641 Dicing Saw Refurbished condition, Sold in good working conditionYear: 2002
Tool Status Running Wafers Wafer Size 300 mm Fab Section Thin Film Asset Description Producer SE mainframe & 3 chambers Software Version B3.9_56 CIM SECS, GEM Process BD i, BD i, BDIIx Hardware Configuration (fab): Main System Producer SE - 1 Handler System 2 FI robots & 1 MF robot - 3 Factory Interface FOUP - 2 Hardware Configuration (subfab/ …Year: 2014
Hitachi (Semiconductor) RS-6000 SEM - Defect Review (DR) Currently Configured for 300mm wafer size MFG Date: 25-Jul-14 EQUIPMENT DETAILS: Model: RS6000E with Options iPQ Function A-1 RS6000E VR25 Main System (300mmWafer Use, AC208V/60Hz) including: - 2 Wafer Holders(for 300mm) - ADR (Auto Defect Review) Function - 3 Kinds of Image acquiring system - SE/Left/Right Image - Optical Microscope ( for …Year: 1995
Canon fpa-1550m4w 1995 Wafer size 6Year: 2005
Wafer Characterization Metrology Equipment Currently Configured for: 300mm Asset HDD not included Wafer Characterization WAFS001 KLAT WAFERSITE SHAPE/FLATNESS Status: Tool was shut down and moved to a storage location on site. Configuration: Audit to verify. Standard System Configuration Double-sided interferometric flatness and shape gauge Semi M49 mode 2mm capacitance probe emulation mode Capacitive thickness gauging with traceable auto-mastering block Wafer …Year: 2000
Hitachi Kokusai Electric VR-120S 2000 Wafer size 12