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Applied Materials Endura II Liner/Barrier P01118033
Applied Materials Endura II Liner/Barrier P01118033

Applied Materials Endura II Liner/Barrier Wafer machine Verified seller

Price on request

Manufacturer Applied Materials
Model Endura II Liner/Barrier
Year 2006
Location Unknown country XX
Category Semiconductor - Wafer equipment
Product id P01118033
Language
bg Applied Materials Endura II Liner/Barrier
cs Waferovací stroj Applied Materials Endura II Liner/Barrier
de Applied Materials Endura II Liner/Barrier Waferanlage
en Applied Materials Endura II Liner/Barrier Wafer machine
es Máquina para wafer Applied Materials Endura II Liner/Barrier
fr Machine pour wafer Applied Materials Endura II Liner/Barrier
hr Applied Materials Endura II Liner/Barrier
hu Applied Materials Endura II Liner/Barrier
it Macchina per wafer Applied Materials Endura II Liner/Barrier
nl Applied Materials Endura II Liner/Barrier
pl Maszyna do produkcji płytek półprzewodnikowych Applied Materials Endura II Liner/Barrier
pt Applied Materials Endura II Liner/Barrier
ru Applied Materials Endura II Liner/Barrier Пластина
tr Wafer Makinası Applied Materials Endura II Liner/Barrier
Applied Materials Endura II Liner/Barrier PVD (Physical Vapor Deposition)
Currently Configured for 300mm wafer size
MFG Date: January, 2006
EQUIPMENT DETAILS:
Tool is operating in clean room.
A HARD DISK DRIVE WILL BE REMOVED FROM TOOL.
[Chamber 2]
For Ti PVD chamber
DCPS;OPTIMA DCG-200,ENI,for PVD
PUMP/CRYO,OBIS,HELIX
HT ESC type stage

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. Exapro recommends to check the details with the seller before a purchase

-------------------
Worked hours
Hours under power
State good
At local norms yes
Status visible
Client type Reseller
Active since 2010
Offers online 124
Last activity Sept. 25, 2023

Description

Applied Materials Endura II Liner/Barrier PVD (Physical Vapor Deposition)
Currently Configured for 300mm wafer size
MFG Date: January, 2006
EQUIPMENT DETAILS:
Tool is operating in clean room.
A HARD DISK DRIVE WILL BE REMOVED FROM TOOL.
[Chamber 2]
For Ti PVD chamber
DCPS;OPTIMA DCG-200,ENI,for PVD
PUMP/CRYO,OBIS,HELIX
HT ESC type stage

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. Exapro recommends to check the details with the seller before a purchase

Specifications

-------------------
Worked hours
Hours under power
State good
At local norms yes
Status visible

About this seller

Client type Reseller
Active since 2010
Offers online 124
Last activity Sept. 25, 2023

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Applied Materials Endura II Liner/Barrier Wafer machine